High bonding strength- 24MPa on enamel and 26MPa on dentin
Primer and bond in one bottle
No extra etching required – Saves your time and steps of restoration
Short Polymerization Time (10 sec)
Compatible with all conventional light-cured composite material
No storage in the refrigerator is necessary
Free of TEGDMA/ MMA – Biocompatible and long-lasting
Mild etch: pH value >2 – Gentle etching, reduces the risk of hypersensibilities
₹1,300 (Incl. GST)
MRP :
(Incl. GST)
MRP :
Out of stock
Delivery within 2 to 7 Working Days
Manufacture/Marketer: Mani. Inc
Door Step Delivery
Quick and Secure
No Hidden Charges
Pay only what's shown
18K Pincodes Served
With Trust & Reliability
Mani Selective Etch Bond is a self-etching, light-curing one-component bonding for a safe and reliable bond to filling composites on natural teeth in only one step. The Optimized formula from Germany builds absolutely homogeneous adhesive layer avoiding pooling. Free of TEGDMA / MMA for exceptional bond strength onto natural dental enamel. The adhesive can be used in both self-etch and selective etch techniques.
Indirect restorations made from composite and ceramic (inlays, onlays, veneers, crowns) with light-cured and dual-cured luting composites
Intraoral repair of porcelain, composite, and metal using light-cure composite resin
Repairs fractured composite fillings
It is compatible with all conventional light-cured composite materials
Packaging:
1 x 5 ml Bottle
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SKU
Kog_Mani-SEB
Country of Manufacture
Vietnam
Unit of Measure
Each
Shelf Life
2 years
Request for Quote
No
Return/Buy Back policy
N/A
Manufacturer Address
Mani. Inc
Prescription Required
No
Brand
Mani
Seller
Kogland Commerce Pvt Ltd
Mani Selective Etch Bond is a self-etching, light-curing one-component bonding for a safe and reliable bond to filling composites on natural teeth in only one step. The Optimized formula from Germany builds absolutely homogeneous adhesive layer avoiding pooling. Free of TEGDMA / MMA for exceptional bond strength onto natural dental enamel. The adhesive can be used in both self-etch and selective etch techniques.
